Agnes Kwan

agnes-kwanAgnes is part of the Intel communications team and is responsible for creating awareness of the power of Atom processor in bringing intelligence and connectivity to a wide array of devices. Agnes has been with Intel for over 10 years, started off with the Intel Asia Pacific team out of the Hong Kong office and moved to California 7 years ago. With over 15 years in communications, she has served in various capacities within the Intel’s communications team, including covering the company’s wireless and networking business, being the international PR manager for the global communications team and supporting the education technology platform business for the company.


Aicha Evans

aicha-evans_1_webCorporate Vice President, Platform Engineering Group
General Manager, Wireless Platform Research and Development Group

Aicha Evans is corporate vice president and is general manager of the Intel Communication and Devices Group in the Platform Engineering Group. She is responsible for driving wireless engineering for multi-comm products and Intel platforms, including modems, RF, Wi-Fi, GPS, Bluetooth, NFC, FM, LTE, WLAN/WWAN as well as emerging wireless technologies to lead this industry going forward. Prior to PEG, she held the same title and role within the Mobile and Communications Group.

Previously Evans was the general manager of the Wireless Platform Research and Development Group where managed the engineering, software, hardware, strategic planning, and product test teams responsible for providing wireless connectivity ingredients and solutions for all Intel platforms.

Evans joined Intel in 2006 as a software integration and test manager. She held a number of management positions responsible for Intel’s wireless efforts including software engineering and support for customers deploying WiMAX networks in multiple geographies. Additionally, she worked in Israel managing WiFi engineering and product lines. Prior to Intel, Evans spent 10 years in various engineering management positions at Rockwell Semiconductors, Conexant and Skyworks. Evans received a bachelor’s degree in computer engineering from The George Washington University in 1996.

Allyson Klein

Director of Leadership Marketing, Server Platform Group, Intel Corp

Allyson Klein manages the Server Technology and Software Strategy team within Intel’s Server Platform Group. In this role she oversees the marketing for server technologies as well as software priorities for future Intel server platforms. Allyson has been driving server technology marketing for Intel for the past eight years including oversight of Intel’s I/O, memory, virtualization, and data center efficiency initiatives. She also has driven marketing programs for industry groups including the InfiniBand Trade Association, PCI SIG, Itanium Solutions Alliance, The Green Grid, and Climate Savers Computing Initiative. Allyson holds a BA from the University of Oregon in Marketing and Management and an MBA from Portland State University.

About Allyson’s Blog: Chip Chat

Intel® Chip Chat is a recurring podcast series focused on Intel technologies that brings you news, information and interviews from the technologists themselves. Hosted by Intel technology marketing manager Allyson Klein since 2007, each informal interview with a technology expert runs about five minutes and covers topics such as Intel micro-architecture and silicon innovation, virtualization technology, cloud computing, storage innovation, interconnect technologies, mobility and mobile device innovation, data center technologies, eco-technology, and Intel research areas.

Asha Keddyasha-keddy

Asha R. Keddy is Vice President in the Platform Engineering Group and General Manager of Next Generation and Standards at Intel Corporation. She is responsible for fostering innovation and industry standards in mobile communications, including investigating and developing new technologies, ecosystem intelligence and collaboration, and translating those activities into products. Her organization’s areas of focus include designing and developing tomorrow’s mobile technologies to create the future for the wireless ecosystem (4.5G to 5G, connectivity evolutions and platform evolutions) and translating these into products. Focus areas span driving a holistic end-to-end approach and technology office functions that include all forward looking components of Intel’s Communication and Devices Group such as RF, hardware, algorithms, systems, modems, early prototypes and platforms, as well as wireless standards. She holds multiple patents in mobile broadband technologies, with additional patents pending.


Bill Calder

Bill Calder is a corporate communications manager with a long history developing PR and communications strategies around various Intel technologies and initiatives. He has been with Intel for 14yrs serving in public affairs and corporate communications and always with an eye on the media. Calder has worked on a variety of projects over the years from Intel’s initial move into consumer electronics, to mobile technology, networking, silicon manufacturing, environmental health and safety, and more. Recently Calder was instrumental in developing the strategy and the communications behind the announcement of the Intel® Atom™ processor brand and for establishing a new category of low-cost devices based on Atom known as “netbooks” and “nettops.”

Prior to joining Intel, Calder worked in the U.S. Senate as press secretary to Senator Mark O. Hatfield. Prior to that, he spent several years as a journalist working for the Portland Oregonian and the Eugene Register-Guard.


Bruce Patterson

Outbound Marketing Manager for Intel® NUC and Compute Stick

Bruce is part of the Channel Innovation and Solutions Division team at Intel. As the outbound marketing manager he’s spent the past 7 years focusing on developing and bringing new compute solutions to the market. He’s responsible for leading external marketing efforts for the Intel® NUC and Intel® Compute Stick products; developing and executing marking strategies, serving as the primary press liaison for the organization, as well as creating the messaging to consumers and businesses about these new product categories.

Over the last 20 years at Intel, Bruce has held a wide range of roles including factory management of a systems manufacturing facility, strategic marketing driving Intel desktop compute vision into the market place, organizational development for a team of 600 employees, and leading a team of program managers responsible for a wide range of product development teams. Previous to Intel he worked at a small startup company as the lead hardware designer and programmer. Bruce received a Bachelor’s degree in Electrical Engineering from University of Portland, a Masters in Engineering Management from Northwestern University, and a Masters in Business Administration from Northwestern University.


Cara Walkercara2013

Cara is part of the Intel communications team, and supports the company’s efforts in mobile and wireless communications. Cara is new to Intel, but not to wireless having spent the last decade working with companies to launch breakthrough products and services in the fast-paced, ever-changing and “totally addicting” mobile industry.



Chris WalkerChris Walker

General Manager for Tablets, Mobile & Communications Group
Intel Corporation

Chris Walker is the general manager for revenue platforms for tablets in Intel’s Mobile & Communications Group. In his current capacity, Chris is responsible for product line management; OEM design wins, and platform roadmaps; and the P&L for the application processor business targeting tablets and volume 2-in-1 devices based on the Atom architecture. Chris has been with Intel for more than 20 years with various operations, finance, product marketing and business development roles. Chris holds his BS in Industrial Management from Carnegie Mellon University and lives in Silicon Valley.



Christoph von SchierstaedtChristoph_Schierstaedt_04

Communications Manager
Intel Corporation

I started at a radio station in Bavaria where I learned a lot about journalism, I worked for agencies and newspapers. Later (2003) I entered the “other side” of Media and Communications, when joining Infineon Technologies AG as Manager Internal Communications. After that I joined the Media Relations Department and became Spokesperson for Infineon. In 2009 I joined a fast and nimble Company for Broadband Semiconductors: Lantiq! For five years I was responsible for Communications at this great company, which recently got acquired by Intel. And here I am.

Claudine Mangano


Claudine Mangano is a corporate communications manager with a long history of developing communications strategies around various Intel technologies and initiatives. She has been with Intel for more than 15yrs and has worked on a range of efforts spanning products and technology, consumer and business. Recently, Claudine was instrumental in helping to lay the communications groundwork for Intel’s presence in wearable technology. Over the years, she has also influenced the introduction of the first smartphones based on Intel technology, the launch of the Intel Galileo board for the maker community, and spearheaded the introduction of Intel’s “Silvermont” microarchitecture.

Claudine holds a BA in communication from the University of Southern California.



Connie Brown

Connie Brown is a media relations manager for Intel Corporation’s mobile products and technology efforts. She has been with Intel in communications and marketing roles for 8 years and has 19 years of experience in communications fields. She has a journalism degree in news writing and public relations from the University of Northern Colorado.

Outside of working on the latest greatest Intel mobile technology Brown is suburban soccer mom of 4. She can also be found reading, running, and logging into Twitter (cmbrown39) or Facebook.


Daniel Snyder

Dan Snyder is a technical PR manager specializing in consumer usages of the PC. He has been with Intel since 1991. In his current role based in Santa Clara, California, Dan works with technical journalists worldwide to promote Intel’s latest technologies, such as the Intel® Core™ i7 processor family. He has logged hundreds of hours of print, radio and on-air television interviews.

Prior to this position Dan was European developer relations manager for audio and video on the PC, working with the top software and hardware developers in Europe. Based in Munich, Germany, he helped enable customers to deliver and promote fun PC usages such as home music recording, personal video editing, digital photography, etc.

Dan began his career with Intel in an engineering role at one of the company’s largest fabrication and assembly factories in Arizona. In 1994, he moved into a Technical Marketing position in Santa Clara involving Intel’s processors for mobile computers. From 1996 to 1999 Dan drove worldwide marketing initiatives with OEMs and Retailers for the Pentium™ Processor family of products before moving to Europe for his role there.

Dan holds an Engineering degree from Columbia University and an MBA from Stanford.

David Angell

David Angell is the Go-to-Market Product Marketing Engineer at Intel for PC Client Wireless Marketing. He communicates wireless technology and product information to technical, enterprise and consumer audiences. David manages Intel® Wireless content development and digital marketing campaigns (SEM, social media, Prior to joining Intel in 2005, he authored more than 20 how-to technology books, including DSL For Dummies, The Elements of E-Mail Style, and the Microsoft Office Word 2003 Bible. David was also a regular contributor and columnist for leading technology magazines.

Don Verner

Don is a Senior Applications Engineer in Intel’s NAND Solutions Group and has worked with nonvolatile storage technologies since 1988. Don helped pioneer flash memory as BIOS storage in desktops and mobile systems as well as defining a new flash memory part used in these applications. While in Japan in 1995, Don helped advance flash memory usage in digital photgrapy and digital audio. He then worked for the field as a Regional Application Specialist supporting Embedded Intel Architecture, a desktop Technical Sales Manager for the Intel P4 Launch and a Storage Architecture Specialist. Don currently provides EMEA SSD Application support, directs the NSG SSD Tools Support and manages the NSG SSD demo development. Don is active in working with the local Boy Scout Troop as well as training Boy Scout adult leaders, supports the local recreational and high school swim team computer operations and when possible plays guitar and bass.

Doug L. Davis

Vice President
General Manager, Netbook and Tablet Group

Doug Davis is a corporate vice president and is general manager of the Netbook and Tablet Group (NTG) within the Intel Architecture Group. This group is responsible for the platform planning, architecture, enabling and marketing of Intel’s solutions for the Netbook and Tablets market segments.

Davis started his career at Intel as a product engineer in the Military Division; where he went on to manage product engineering, manufacturing and operations for the group. Following that, he became the operations manager and later general manager for the Embedded Microcomputer Division, and general manager of the Network Processor Division. He became a business unit vice president in 2003. In 2004, he assumed the general manager role of the Infrastructure Processor Division, which formed from the consolidation of all of Intel’s embedded processor efforts. In 2005, Davis became the general manager of the Embedded and Communications Group where he was instrumental in establishing Intel’s position in embedded market segments such as communications, automotive, retail and industrial control. In 2010, Davis became the general manager for the Netbook and Tablet Group.

Davis graduated from New Mexico State University in 1983 with a bachelor’s degree in Electrical Engineering. He earned his master’s degree in business administration from Arizona State University in 1992.

Eric Levander

Network Infrastructure Competence Centre

Eric joined Intel in 1996 and is based in Intel’s Swedish office in Kista.

In his current role he is responsible in EMEA for Intel’s strategic direction and operational engagements on the Communications Infrastructure market.

He has held a variety of international positions within Intel’s Sales and Marketing Group. Starting as a field sales engineer he moved on to Nordic channel manager and later European field marketing manager. Prior to taking on his current role he was leading Intel’s global engagement with Ericsson/SonyEricsson, Nokia Siemens and Alcatel Lucent.

Eric holds two business degrees, from Linköping- and Stockholm University, and has completed management programs at INSEAD, Paris and Darden School of Business Administration, Virginia.

Esther Baldwin (孟木兰)

Esther is currently working in Intel Research as their Proliferation Manager and has worked for Intel for over 20 years. She joined the Intel ASIC start up in 1987 in the CAD Engineering department. Esther has over six years experience in Technology Manufacturing Engineering supporting Intel’s high volume manufacturing community. She was a member of the Pudong, Shanghai, China factory startup team. Esther was a member of the virtual Corporate Site Selection team conducting research for where Intel should invest in new factories and locations. Esther was a conference steering committee member session chair for Intel’s Manufacturing Excellence Conference for six years — driving operational excellence into the global manufacturing community. She was assigned to the Intel Online Services Operations Management team in 1999, a new global data centre business for Intel.

In 2002 Esther joined Information Technology and completed an assignment to Shanghai to establish a culture of systemic innovation and start up the China Innovation Centres. Esther is an Eisenhower Fellow. In 1997 she was the first US Eisenhower Fellow to Ireland and spent six weeks in the Irish region studying foreign direct investment and its impact on local industries. She later presented her findings to former President George H.W. Bush. Esther was appointed Economic Advisor to the Jieyang Municipal Government, Guangdong, PRC for a 5 year term commencing Dec. 2006. As advisor to the Asia Capital Forum — Nanchang Summit — she provided advice to the mayors of six cities representing 24 million people.

Esther holds a BSc Dual Major in Design and Design Engineering Technology from Brigham Young University funded by dance scholarships, and a Master’s Degree in International Management with honors in Political Science and Language (Mandarin) from The Thunderbird School of Global Management. Esther enjoys learning about new cultures and languages.

Genevieve Bell

I grew up in Australia, moving between the working class suburbs of Melbourne and Canberra and the Aboriginal communities of Central and Northern Australia. As a kid, I thought I would grow up to be a fire fighter or a dentist or a barrister or perhaps the first woman Prime Minister of Australia. I never imagined I would end up here – in America, with a PhD in anthropology, working for a multi-national corporation, making sense of people’s every day practices, helping innovate new technologies and new technology paradigms. But maybe it isn’t such a big stretch. My mother is anthropologist, my father an engineer – perhaps this is just what I was supposed to be doing all along.

I joined Intel in 1998 – a moment of irrational exuberance all around – fresh out of Stanford, with a newly minted PhD in cultural anthropology and a strong expertise in Native American ethno-history. It was an odd match from the very beginning. Yet more than eight years, countless fieldtrips, at least one patent, lots of publications, and many many meetings later, I am still here and still doing work that I find challenging, rewarding, frustrating and thoroughly engaging.

I am currently the Director of User Experience within Intel’s Digital Home Group where I manage an inter-disciplinary team of social scientists, interaction designers and human factors engineers. We strive to stay ahead of Intel’s technology roadmap, using insights gained for in-depth ethnographic and design research to help drive innovations in and around Intel platforms, creating technology that responds to human needs, desires and aspirations.

About once a fortnight (that’s every two weeks for our American friends), my team and I will blog under Technologies for our Lives about what we are seeing in our travels and our labs, what we are driving here at Intel, and what excites us, and perhaps more importantly why. I hope we can give a small glimpse into the kind of work we do, how we do it and where it is all heading. This blog will be about making the future, in all its messiness.

Janice M. Golda

Director, Lithography Strategic Sourcing, Intel

Janice leads an organization responsible for creating and executing Intel’s lithography, mask, metrology, inspection, and lab supply chain strategy. Her integrated technical and business team enables the supply chain to deliver capital equipment and masks meeting Intel’s technology roadmap, manufacturing, affordability, and time to market requirements. Janice manages Intel’s technology roadmaps in these areas.

Janice has represented Intel on several industry and conference advisory boards including Sematech and ITRS Lithography, is Chairman of the Board for the EUV LLC, and is Intel Senior Sponsor for Cornell University. She has presented and published at numerous industry forums. Janice joined Intel in 1989 as a lithography engineering. She holds one US patent. Janice earned a BS degree in Electrical Engineering from Cornell University.


Jay Melican

Jay-MelicanJay Melican is Intel’s Maker Czar. He currently serves in the company’s New Devices Group, coordinating internal maker-related initiatives and Intel’s outreach to the maker community. In this role, he works within Intel and with partners on programs that help inspire creativity, enthusiasm for learning, and invention with the Intel® Galileo and Intel® Edison platform technologies. At Intel, Jay has worked as a research scientist and design team manager in Intel Labs and in the company’s Digital Home Group. He has a background as a design ethnographer, user researcher, interaction designer and product strategy consultant. He holds a BA from Brown University, an MFA from Rhode Island School of Design, and a PhD in design from IIT.

Hermann Eul

Jason Waxman

General Manager, Cloud Infrastructure Group (CIG) Hillsboro, Oregon

Jason Waxman is General Manager in Intel’s Data Center and Connected Systems Group leading the Cloud Infrastructure Group (CIG). He is responsible for Intel’s products and technologies for large datacenters including silicon components, optimized system design, software, management and data center facility optimization. Jason’s business responsibility focuses on working with systems and software vendors to address the needs of the high-growth cloud service provider industry including internet datacenters, telcos, infrastructure / software-as-a-service and hosting. Jason holds executive positions in industry design efforts including the board of the Open Compute Foundation, the Server System Infrastructure Forum and as technical advisor to the Open Data Center Alliance. Jason has spent the last 14 years of his Intel career in Enterprise computing focused on server products and technologies involved in the introduction of over 12 new platforms. Prior to Intel, Jason worked in strategic planning for an industrial components company and as a management consultant. He holds Bachelor and Masters Degrees in engineering and a Masters of Business Administration from Cornell University. He can be followed on twitter @jpwaxman.

Jim St. Leger

Jim St. Leger is the technology marketing manager in Intel’s Embedded and Communications Group (ECG.) He’s helping the industry understand how to navigate and capitalize on the transition to multicore processors which involves both hardware and software challenges. His application work focuses on applying multicore Intel Architecture to communications infrastructure designs, including application, control, and data plane workloads. Prior to Intel Jim worked in various manufacturing, product engineering, and marketing roles in the automotive, aerospace, and semiconductor equipment industries. He holds degrees from Rensselaer Polytechnic Institute (a.k.a. RPI) and Northwestern University.

Jeff Galinovsky

Jeff Galinovsky is currently a Regional Manager for Intel’s classmate PC activities in North America where he focuses on expanding EMPG’s education products there as well as building an education ecosystem around classmate PCs. He is also very involved in his 2 daughter’s education and you may even see his older 10 year old daughter, Mackenzie, with him at Intel events as she is an avid classmate PC user! Additionally, Jeff was just recently appointed as a Vice President Board of Director to a newly created Education Foundation for the Folsom-Cordova Unified School District focusing on technology and developing programs for 21st century skills.

Jeff has been at Intel for over seventeen years where he has held several positions in Engineering and Management including; CPU Product Development, Software Development, Software Engineering Management, Strategic Program Management, Strategic Marketing, and Platform Management. Most recently Jeff has spent the last four years working (and traveling the world) on developing and bringing to market unique platforms for Education Markets. Jeff holds a Bachelors of Science in Electrical Engineering from the University of Toledo and a Masters of Business Administration (MBA) from the University of California at Davis. Jeff also teaches MBA classes to working professional students at a local University.

Jeffrey Frizzell

I am a validation architect in Intel’s Visual & Parallel Computing Group. In this role, I provide technical direction to the testing of the graphics drivers for Intel’s processor graphics solutions. My primary focus has been on 3D and parallel compute APIs such as DirectX, OpenGL, OpenCL. I have also driven initiatives in automated testing, continuous integration, and pre-silicon testing of our drivers. I’ve been with Intel at the Folsom, CA campus for 11 years, working for 7 years on internal IT systems before moving to graphics in 2006.

Prior to Intel, I worked as a developer at Sherpa Systems Corporation on PLM software and before that automating lab and clinical trial data analysis at Abaxis (biotech). My degree is in Aeronautical Engineering from Cal Poly, San Luis Obispo.

Outside of work, my wife and I spend a lot of time at soccer/volleyball/scouting with our 3 kids. I enjoy reading, watching football and hockey.

Joe Jensen

Joe Jensen is the general manager of the Embedded Computing Division for the Embedded and Communications Group at Intel Corporation. The Embedded Computing Division is responsible for driving Intel architecture products into the embedded market. Previously, Joe directed the strategic planning, marketing and operations for Intel’s Consumer Electronics Group. He was also the general manager of the Embedded Intel Architecture Division within Intel. Intel’s Embedded Intel Architecture focus is the development of new market segments and applications for Intel core PC and server technologies. These market segments include communications, point-of-sale, industrial computer and educational computing. Joe has a bachelor’s degree in Electrical Engineering from South Dakota State University and a master’s degree from Arizona State University. He started with Intel in 1984 in engineering and has worked in all aspects of the semiconductor business, including product design, manufacturing and marketing.

John Healy


John Healy is the GM of the “Software Defined Networking Division” in CSIG. He is one of the leading strategists behind software-defined networking. John’s leadership in intelligent systems for the communications industry is comprised of 23 years of experience in engineering, network deployment, transmission planning, switching and maintenance. Prior to his work in the communications group, John held positions in Finance, Information Systems, Network Planning and Sales Management at Intel. He is an engineering graduate from the University of Limerick in Ireland.


Josh Walden


Josh Walden is senior vice president and general manager of the New Technology Group at Intel Corporation. Walden oversees Intel’s global research efforts in computing and communications. Additionally, he leads teams creating and deploying new technology categories such as interactive computing devices, perceptual computing and wearable devices.

Before assuming his current position, Walden worked in a variety of strategic and operational roles at Intel. Most notably, he served as vice president and general manager of Intel’s Platform Engineering Group, where he led worldwide engineering teams that were responsible for the development, manufacturing and validation of Intel’s chip portfolio. He also previously led Intel’s Fab/Sort Manufacturing organization, where he was responsible for the company’s global wafer manufacturing operations.

Walden joined Intel in 1983 as a process engineer in Santa Clara, California, and has held numerous roles in wafer manufacturing and technology development throughout his career, including overseeing the startup and initial high-volume manufacturing of Intel’s first international 300mm wafer fabrication facility in Ireland.

Walden earned his bachelor’s degree in chemical engineering from the University of Florida.


Julie Coppernoll

Julie Coppernoll is vice president and director of marketing in the Client Computing Group. She is responsible for product and customer go-to-market activities, platform positioning and launch, and external messaging across all Intel® Core™, Intel® Atom™ and communications platforms. She also spent 4 years as a technical assistant to Andrew S. Grove during his tenure as Intel chairman of the board. In that role, her key focus was on accelerating Intel’s efforts in the mobile and wireless arenas.




Kari Aakre

Kari Aakre manages the consumer and social media relations team, responsible for the company’s consumer PR and social media outreach in Intel’s Global Communications Group. She’s worked in PR at Intel for nearly 8 years, covering a variety of areas from enterprise software, Intel’s R&D efforts, to the digital home and launch of Intel Viiv technology brand, WiMAX, as well as the company’s leading silicon technology and manufacturing. Most recently she worked on the media campaign for Intel’s “reinvented transistor” breakthrough for Intel’s 45nm high-k metal gate process technology, and also led the Intel PR outreach around Intel’s $1 billion investment in a new wireless broadband company to be formed via an agreement between Clearwire and Sprint. Prior to joining Intel, Aakre worked at an Oregon-based tech PR agency. She has a journalism degree from the University of Oregon and is based in Portland, Ore.

Karl Shurts

Karl Shurts is a Senior Product Marketing Engineering in the desktop processor marketing team for Intel’s PC Client Group. He has been the marketing lead for Intel’s high end desktop processors for the last 3-4 years beginning with Intel’s first quad-core product, the Intel® Core™2 Quad QX6700 though to the latest 6 core product, the Intel® Core™ i7-980X. He has been at Intel for 13 years working in both Information Technology and CPU Product Marketing. He has a BA from Brigham Young University and an MBA from UT Austin.

Outside of work, Karl spends most of his time with his wife and 8 kids. He has 5 PCs in his house so everyone can get their homework done on time —and it still isn’t enough. He needs his own IT department! Look for Karl’s blog posts under the Digital Home category.

Kelin Kuhn

Kelin J. Kuhn is an Intel Fellow, Technology and Manufacturing Group and director of Advanced Device Technology. Kuhn is responsible for device architecture path finding for Intel’s advanced process technologies.

Kuhn joined Intel in 1997 working on Intel’s 0.35 micron process technology. Since then, Kuhn has been involved in Intel’s manufacturing process technology development for the 0.35 um, 130nm, 90nm, 45nm and 22nm technology nodes.

Previously, Kuhn was a tenured faculty member in the Department of Electrical and Computer Engineering at the University of Washington. Kuhn is the past recipient of a National Science Foundation Presidential Young Investigator Award for her work on strained layer III-V materials and an Intel IAA award for her work on Hi-K metal gate transistors. Kuhn has six patents with four others pending, is the author of more than 60 technical papers, and has authored a textbook on laser engineering. Kuhn earned her bachelor’s degree in electrical engineering from the University of Washington in 1980.

Kuhn received her master’s and doctoral degrees in electrical engineering from Stanford University in 1985.

Knut Grimsrud

Knut is an Intel Fellow and leads an R&D group responsible for developing new mainstream storage innovations for Intel platforms. His team develops the core technology behind Intel’s new high-performance solid-state drive (SSD), as well as contributes to the definition and evolution of several storage interfaces including ONFi (Open NAND Flash Interface), NVMHCI (Non-Volatile Memory Host Controller Interface), and Serial ATA.

Knut joined Intel in 1993 as a hardware engineer in the Intel Architecture Labs where his primary focus was on improving the storage performance of Intel’s entry into the standard high-volume server segment. His focus transitioned to mainstream storage optimization techniques where his contributions included disk reorganization techniques for improved application launch performance. Knut then drove definition of the Serial ATA disk drive interface standard and its subsequent evolutions and enhancements, which continues today. His current primary focus is on solid state storage technologies including approaches to make efficient use of NAND flash in the platform and new technologies for high-performance NAND-based SSDs.

He received his bachelor’s, master’s and Ph.D in electrical engineering from Brigham Young University. He also holds 31 U.S. patents and serves as chairman of the board of directors for both the Serial ATA International Organization (SATA-IO) and the Open NAND Flash Interface organization (ONFi).

Krystal Temple

Krystal Temple joined Intel in September 2010 as part of the Intel Global Communications Group providing media relations support for the Embedded & Communications Group. Krystal is responsible for increasing awareness for Intel’s smart and connected technology solutions in areas such as automotive, retail, digital signage, medical and fitness. With everyday experiences from shopping to working out becoming increasingly connected, there are endless possibilities for innovative devices beyond the PC with Intel technology inside. Krystal is based in Arizona and holds a public relations degree from Arizona State University.

Laurie Buczek

Laurie Buczek is a Social Media Strategist within Intel Corporation’s Digital Marketing organization. Prior to joining Digital Marketing, Laurie spent over two years as the Social Computing Program Manager where she was responsible for the major enterprise wide strategy & implementation of social computing for employees to connect & collaborate internally. Laurie began her social media journey three years ago while blazing a new trail for online marketing efforts by helping to launch & manage the first external social media community for Intel. Laurie’s work has been published and showcased across the industry. She is also a member of the 2.0 Adoption Council and Social Media Business Council.

In addition to the experience within the social media space, Laurie has almost 18 years in high technology working in marketing, consulting and sales. In her life before Intel, Laurie worked for Forrester Research and Gateway, Inc.

Navin Shenoy

Corporate Vice President
General Manager, Mobility Client Platforms

navin-shenoy_2Navin Shenoy is corporate vice president in the Client Computing Group and general manager of mobility client platforms at Intel Corporation. He leads strategy and product development and manages the profit and loss (P&L) for Intel’s mobile computing product lines, including notebooks, 2 in 1 devices and tablets. Shenoy also oversees Intel’s connectivity strategy, which encompasses the wireless communications P&L, client Ethernet solutions and Intel’s Thunderbolt™ technology.

Before assuming his current role, Shenoy was general manager for Intel Asia Pacific, where he was responsible for all sales, marketing and enabling of Intel products in the region. Earlier in his Intel career, Shenoy spent three years as technical assistant to former Intel President and CEO Paul Otellini. In that role, he assisted Otellini in the development and implementation of Intel’s long-term corporate strategy and the daily management of Intel’s global business.

Shenoy joined Intel in 1995 and spent several years in a range of roles within Intel’s sales and marketing organization. His positions included regional solutions manager for Southeast Asia, a Singapore-based role in which he was responsible for Intel’s relationships with end users, independent software vendors and service providers; and Northern California district manager for Intel Online Services, where he worked closely with Google.

Shenoy earned a bachelor’s degree in electrical engineering from the University of Michigan and attended the Stanford Executive Program at Stanford University.

Dr. Necati Canpolat

Sr. Staff, Intel Communication and Devices Group

Dr. Necati Canpolat has been with Intel Corporation since 1997. He is part of Intel Communication and Devices Group and he has been focusing on mobile communications R&D, product definition, path finding, industry engagement, standards development, forging partnership and ecosystem formation. Prior to joining Intel, he has worked at Qualcomm Inc., developing CDMA system software.

Dr. Canpolat has over 20 years of experience in the communication industry. He is a director of at the WBA board. He has held a number of officer positions in various organizations including IEEE 802.11, Wi-Fi Alliance, WBA and also GSMA. He has been recently working on Wi-Fi in 5G, Carrier Wi-Fi, Wi-Fi Calling, IoT, Coordinated Shared Spectrum, Licensed and Unlicensed Convergence, Multi Band Operations, Hotspot 2.0, Wi-Fi offloading and LBS over Wi-Fi.

Dr. Canpolat holds a Ph.D. from Oregon State University and Master’s degree from Colorado State University.

Paul Tapp

Paul Tapp is a Sr. Product Manager for Perceptual Computing at Intel. Paul joined Intel in 2003 and has held various technical and marketing management roles during that time. Over the past 5 years Paul and team have been responsible for development and evangelism of some of Intel’s consumer product lines.

Intel’s Perceptual Computing offerings have been evolving and maturing significantly in the past months and Intel has worked closely with OEM’s, ISV’s and other technology vendors and ecosystem partners to make Perceptual Computing a reality for consumers. Paul recently moved from the United Kingdom to Intel’s headquarters in Santa Clara.

Follow IntelPerceptual on Twitter | Facebook | YouTube | Vimeo.

Robert Allshouse

Since beginning at Intel in 2000, Rob has been working in the Flash memory groups in various roles, from engineering technician to business development manager. Rob’s blogging experience began in 2007 with the beginning of his love for running. Since 2007, Rob has been maintaining personal blogs on his racing, his diving, and more.

A self-identified geek, Rob can be found most times with slashdot up on one monitor, facebook on another, and his work happening right on top of it. He was fortunate enough to have a state-owned PC since kindergarten, and a father who now works as the deputy-director of IT for his home state, so has been living and breathing computing his whole life.

Now joining the Intel blogosphere, Rob brings his experience in the flash industry to help describe the current market, technologies, trends, and more in SSDs, flash drives, and other flash memory markets.


Robert Chau

Intel, Portraits, Hillsboro, Oregon, 08-01-2014Robert S. Chau is an Intel Senior Fellow and co-director of Components Research in the Technology and Manufacturing Group at Intel Corporation. Chau is responsible for Intel’s research efforts, including internal research and external collaborations, to enable future process technology options for Intel’s technology development organizations.





Roxanne Gryder

For the past five years Roxanne has held marketing roles in Intel’s TV related businesses.  She has been with Intel for over 14 years and has worked in various Intel marketing and strategy positions focusing on wireless and media technologies.  Before Intel, Roxanne worked as a producer in the post production industry at a firm that specialized in special effects and graphics for TV commercials.  Roxanne has an undergratuate degree in film and television from Northwestern University and an MBA from Cornell University.



Sanjay Natarajan

Sanjay Natarajan is Director of 32nm Technology Development in Intel’s Logic Technology Development (LTD) organization. He joined Intel in 1993 after receiving his PhD in Electrical Engineering from Carnegie Mellon University. He has worked in process integration for every generation of Intel logic process technology since the 0.18um technology node. He led transistor development for the 65nm technology node and managed the overall 32nm development program, which began production in late 2009. He has received 1 Intel Achievement Award and has 5 patents in the area of advanced process technology development.


Sanjay Vora

Vice President, Client Computing Group
General Manager, User Experiences

Sanjay Vora is vice president in the Client Computing Group and general manager of User Experiences at Intel Corporation. In this role, he is responsible for driving the company’s User Experience strategy & vision to deliver compelling, next-generation experiences across all compute devices. In addition, he leads the Intel Experiences Group responsible for execution & go-to-market for centralized user experiences.
Prior to this role, Vora led Intel’s PC Strategic and Product Planning organization for the company’s largest business, notebook & desktop platforms, with over $33B revenue in 2013. His responsibilities included silicon/technology roadmap and product planning across both consumer and enterprise platforms. Prior to managing the client planning team, Sanjay has held a variety of strategic planning and product marketing roles at Intel.

Since joining Intel in 1997, Vora has been a key player in the development of many of our corporate strategies including establishing the “tick-tock” model, “right hand turn,” Intel’s shift to low power and Ultrabook™ device roadmap.

Vora holds a bachelor’s degree in engineering from Penn State and an MBA from Carnegie Mellon.


Stefan Wolff

Stefan Wolff is vice president of the Product Engineering Group and chief operating officer of the Wireless Platform R&D. Until November 2013 he served as general manager of Multicommunications in the Mobile and Communications Group.

Wolff joined Intel in 2011 through the acquisition of Infineon’s Wireless. For the first years at Siemens Semiconductor prior to the Infineon spin off, Wolff headed Marketing for Cellular Radio Transceivers. He took over Radio Engineering for Mobile Phones and built a new site at Siemens Mobile Phones in San Diego in 2000. In 2003, Wolff transferred to Infineon as vice president Marketing for Mobile Platforms. He became vice president and general manager of Infineon’s RF Business Unit in 2005, where he lead engineering, marketing and business development of all Cellular Radio transceivers, components, and systems. Wolff took over the 3G baseband and platform business as vice president and general manager of Smartphones & RF in 2009. Prior to Siemens, Wolff held development and marketing functions at Robert Bosch and Omecon Electronics.

Wolff holds an Electronic Engineering degree from University of Applied Science, Berlin.

Tom Quillin

Director of Cyber Security Technology and Initiatives, Intel Corporation

Tom leads the team responsible for identifying and addressing Intel product security risks as well as planning products that solve tomorrow’s security challenges. The team also manages Intel’s policy positions on security and privacy. Beyond Intel, Tom works with companies, organizations and government groups to identify and accelerate solutions that make computers safer from attack and easier to recover after an attack. Tom helped Intel create its security and manageability strategy for business PCs, and he forged requirements among leading security and manageability software companies for Intel’s vPro technology products. Since joining Intel in 1998, Tom has led strategies focused on the accelerating innovation with customers and partners and improving collaboration in the PC supply chain. Prior to joining Intel Tom helped to establish and to grow a strategy consulting firm with a track record of successful public policy consulting, grassroots organizing and marketing efforts. Tom earned his undergraduate degree at University of Iowa and an MBA from the University of Pennsylvania’s Wharton School of Business.

Tony Salvador TSalvador-3

Director of Experience Insights Research
Interaction & Experience Research Lab

Dr. Tony Salvador, Senior Principal Engineer, currently directs research in the Experience Insights Lab within Intel Corporation. His team’s role is to identify new, strategic opportunities for technology based on an understanding of fluctuating, global socio-cultural values. Tony leads a team of social scientists and business analysts to look for, find and develop viable opportunities to create local, sustainable value with new high tech products, services and infrastructures. His ongoing research interests concern disruptive innovation practice, development and new market creation with an ethnographic perspective.

Previously, he directed research for the Emerging Markets Platforms Group and was instrumental in the research and design of the Intel powered classmate PC. Prior to that he was a research scientist and co-founder of Intel’s People & Practices Group.

Tony received his bachelor’s degree in Experimental Psychology from Franklin & Marshall College in Lancaster, Pennsylvania. He earned a Ph.D. in Human Factors and Experimental Psychology at Tufts University in Boston. He has over 50 published papers and patents in academic journals as well as more popular venues.

Yaniv Garty

Vice President, Platform Engineering Group
General Manager, Wireless Connectivity Solutions

Yaniv Garty is vice president in the Platform Engineering Group (PEG) and general manager of Wireless Connectivity Solutions at Intel Corporation. He leads a worldwide organization responsible for delivering wireless connectivity technologies and products as well as PEG’s wearable and Internet of Things (IoT) Wireless and SoFIA based SoCs. These products include Wi-Fi, global navigation satellite system (GNSS) and location, Bluetooth, near-field communication (NFC), FM and wireless gigabit (WiGig), in addition to next generation wearable and IoT solutions.

Garty joined Intel in 2004 with the acquisition of Envara Inc. and initially served as chief operating officer of Intel’s Broadband Wireless Division. Subsequently, he managed strategic planning for Wireless Networking Technologies and managed Connectivity Core Solutions, both within the Mobile Wireless Group. Before assuming his PEG position, he held the same role within the Mobile and Communications Group as part of the Wireless Platform Research and Development organization.

Prior to Intel’s acquisition of Envara, Garty ran the company’s North American operation and served as head of Marketing, vice president and general manager. Earlier in his career, he was chief operating officer at Serconet and vice president of Marketing and Business Development at Optibase Inc.

Garty earned his bachelor’s degree in electrical engineering from Tel Aviv University in Israel and went on to obtain his MBA degree from the university’s Recanati Business School.

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