Sneak Peek – Intel Developer Forum Preview

In San Francisco Sept. 22-24, “the world’s biggest geekfest” will take place at Moscone Center West. In its 12th year, the Intel Developer Forum highlights Intel’s upcoming technology advancements and product plans to top CIOs, CTOs, hardware and software experts and industry analysts, bloggers and media.

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Next week, we will have more than 5,000 incredibly talented technologists and media on hand, along with seven Intel exec keynotes, numerous “tech insights” – and another 125 classes, panels and sessions, all in the name of advancing computing and the high-tech industry.

Now, how do you provide an in-depth look at Intel’s plans when we now sell more than 300 products, oversee multiple and exciting new brand families like Core, Xeon, vPro and Atom, and mix in hundreds of R&D projects and a myriad of software, technology and industry standards underway?

The answer, or theme, is found under three 25+ year-old Intel mantras:

  1. Relentlessly pursue Moore’s Law
  2. Deliver world-class manufacturing and capacity – at molecular levels
  3. Constantly innovate and integrate from sand to silicon

All three of these areas will make up the foundation of just about everything you will hear at this year’s IDF. Think about it for a minute. Moore’s Law and our manufacturing prowess, which heads into its second generation of reinvented transistors, have led to an incredible amount of innovation and integration, such as:

  • The omnipresent Core-branded family of laptop and desktop processors — including our next-generation, 32-nanometer process technology “Westmere” or “Dales” chips, and “Sandy Bridge” after that. The Dales will add another first in Intel’s rich history, integrating graphics into our processor products for the first time, increasing performance in areas like videos, and lowering costs.
  • Intel Turbo Technology – a processor that adapts to you? Turbo Boost can automatically adjust processing performance based on the type of work or fun you’re doing on your computer for a quick boost in performance and/or better energy efficiency. Playing a high-end game and doing other things at the same time? We can throw all four processing cores at that. Doing one task that requires a single boost of processing power? Done.
  • Incredible battery life advancements — where we’ve added a multitude of electricity-saving features inside our Core chips, under the battle-cry HUGI, or “huggy” – Hurry Up and Get Idle. All in our quest to maximize the amount of time between re-charging our laptops. In fact, today’s Intel laptop chips go idle even in between keystrokes.
  • A multitude of business-class features — for some of our vPro desktop and laptop PCs and popular Xeon-based servers, including virtualization, security, anti-theft technology and remote computer repair. Those features, and added performance, let CIOs recoup their server investments in months versus years.
  • Larrabee – the codename of an upcoming family of Intel products that ultimately will have numerous processing and graphics engines inside one chip and provide stunning visual computing experiences.
  • Smarter System on Chips (SoCs) – the ability to both tailor and integrate even more technologies into tiny chips for a variety of computing devices.

What else can you expect from IDF besides a private concert with Maroon 5 for attendees? Here’s a snapshot:


Keynotes from Intel President and CEO Paul Otellini, IDF veteran and senior VP Pat Gelsinger and for the first time senior VP of manufacturing Bob Baker will keynote. Look for the latest on our manufacturing, Core and Atom future plans from hand-helds to big-iron servers.


Keynotes from exec VP Dadi Perlmutter and VP Renee James. The emphasis will be on all-things mobile, and of course our newest laptop chips (codenamed Nehalem / Clarksfield). Renee will tie all of Intel’s hardware efforts with our vast and increasing software enabling focus, ranging from the key features and work on Windows 7 to myriad developer programs and plans from handheld to high-end computing.


Senior VP Eric Kim and senior fellow and VP Justin Rattner hit the stage. Both will talk about how smarter processors will be at the heart of innovation to help bring consumers an interactive Internet/TV experience. Look for an update on the company’s “Sodaville” Atom processor, the next generation SoC in a family of media processors based on IntelĀ® Architecture (IA). And, prepare to see a glimpse at what an immersive TV and computing experience will look like in the years to come.

If you’ve read this far, then please take a couple of more minutes and tell us what you want to see at IDF this year…and please follow the industry at IDF via our blog, twitter, facebook and news room.