Semiconductor Engineering Magazine wonders whether Chiplet Technology is Good or Bad. Intel’s answer: Good, Very Good
Mark LaPedus, the Executive Editor for Manufacturing at SemiEngineering.com, recently published an article titled “The Good And Bad Of Chiplets.” From the Intel perspective, there’s only good. LaPedus writes: “With chiplets, the goal is to reduce product development times and costs by integrating pre-developed dies in an IC package. So a chipmaker may have a menu of modular dies, or...
Chiplets (tiles) create a high-speed path for getting new FPGAs to market
These days, trade publications routinely publish articles about chiplets and related technologies. For example, on June 20, Mark LaPedus published an article on the SemiconductorEngineering.com Web site titled “What’s Next In Advanced Packaging” that said: “While scaling remains an option for new designs, the industry is searching for alternatives. Another way to get the benefits of scaling is...