How Heterogeneous Device Design and Manufacturing Leads to Success
By Patrick Dorsey, Vice President Product Marketing, FPGA and Power Products, Intel The following guest blog is based on remarks by Patrick Dorsey during a panel discussion on “FPGA Hardware Innovations” at the recent The Next FPGA Platform event, held in San Jose, California on January 22, 2020. One of the looming challenges for FPGA hardware design is...
Chiplets (tiles) create a high-speed path for getting new FPGAs to market
These days, trade publications routinely publish articles about chiplets and related technologies. For example, on June 20, Mark LaPedus published an article on the SemiconductorEngineering.com Web site titled “What’s Next In Advanced Packaging” that said: “While scaling remains an option for new designs, the industry is searching for alternatives. Another way to get the benefits of scaling is...