Category: Chiplets

• Chiplets (tiles) create a high-speed path for getting new FPGAs to market   These days, trade publications routinely publish articles about chiplets and related technologies. For example, on June 20, Mark LaPedus published an article on the SemiconductorEngineering.com Web site titled “What’s Next In Advanced Packaging” that said:   “While scaling remains an option for new designs, the industry is searching for alternatives. Another way to get the benefits of scaling is...
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