World’s Smallest Standalone 3G Modem Aims to Make Large Impact on the Internet of Things

At the heart of the Internet of Things lies the convergence of computing and connectivity, where even the tiniest of everyday devices—or “things”—can have massive computing capability and intelligence though its connection to the cloud. Today, we commercially launched the XMM™ 6255 modem to provide a wireless solution for the billions of “smart” and connected devices that are expected in the coming years. At about 300 mm2in size, it is the world’s smallest standalone 3G modem, making it perfect for networked sensors and other IoT applications such as wearables, security devices and industrial equipment.

XMM™ 6255 features the SMARTI™ UE2p transceiver, which is based on our unique new Intel® Power Transceiver technology, the industry’s first design to combine transmit & receive functionality with a fully integrated power amplifier and power management, all on a single chip. This design approach reduces XMM™ 6255’s component requirements, resulting in a smaller modem that helps manufacturers minimize their build of material costs. It also protects the radio from overheating, voltage peaks and damage under tough usage conditions, which is important for safety monitors and other critical IoT devices. XMM 6255 Board Size Comparison Embargo 8 26 2014 12am pst

Additionally, the XMM™ 6255 modem features a unique radio architecture that enables it to perform exceptionally well in challenging real-world situations, including:

  • Low signal network coverage: The XMM™ 6255 modem provides reliable communication when it comes to transmitting information in low signal zones like a parking garage or a home basement.
  • Small-sized devices: Devices with a small form factor like a smartwatch or a sensor may not have enough space for a normal-sized 3G antenna, which can affect connectivity quality and reliability. The XMM™ 6255 modem is specially designed for such devices and delivers great 3G connectivity even with small volume antennas not meeting conventional mobile phone quality standards.

The integration of the power amplifier and transceiver you see in this modem also simplifies the design and minimizes device development costs, which means developers can launch more products, more quickly, and in a more cost-effective manner.

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XMM™ 6255 is currently available in the u-blox SARA-U2 module  and we expect to have updates on additional partnerships in the coming months.

We are excited about the potential of the XMM 6255 modem. We are equally committed to the entire Internet of Things ecosystem from setting up IoT standards with other tech companies through the Open Interconnect Consortium to our Intel Galileo IoT Developer Kit.

For more product information, visit: http://download.intel.com/newsroom/kits/atom/comms/pdfs/Intel_XMM_6255_product_brief.pdf

Visit www.intel.com/mobile to explore Intel’s entire portfolio of device, connectivity and network solutions for mobile computing.

 

Stefan Wolff

About Stefan Wolff

Stefan Wolff is vice president of the Product Engineering Group and chief operating officer of the Wireless Platform R&D. Until November 2013 he served as general manager of Multicommunications in the Mobile and Communications Group. Wolff joined Intel in 2011 through the acquisition of Infineon's Wireless. For the first years at Siemens Semiconductor prior to the Infineon spin off, Wolff headed Marketing for Cellular Radio Transceivers. He took over Radio Engineering for Mobile Phones and built a new site at Siemens Mobile Phones in San Diego in 2000. In 2003, Wolff transferred to Infineon as vice president Marketing for Mobile Platforms. He became vice president and general manager of Infineon's RF Business Unit in 2005, where he lead engineering, marketing and business development of all Cellular Radio transceivers, components, and systems. Wolff took over the 3G baseband and platform business as vice president and general manager of Smartphones & RF in 2009. Prior to Siemens, Wolff held development and marketing functions at Robert Bosch and Omecon Electronics. Wolff holds an Electronic Engineering degree from University of Applied Science, Berlin.

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