What a difference a year makes. When Intel formed the New Devices Group, we were given a mandate to go off and investigate new opportunities and new devices that will help Intel grow its business and enable a new era … Read more
Michael A. Bell
Prior to joining Intel in 2010, Bell was part of the executive management team at Palm Inc. From 2007 to 2010 he served as senior vice president of product development. He was responsible for all aspects of product strategy, development and deployment, bringing the Palm PRE, the Palm PIXI and many more products to market. Prior to his time at Palm, Bell was vice president, CPU Software, Macintosh Hardware Division, at Apple Inc. Over the course of his career at Apple, spanning 1991 to 2007, he made significant contributions to the iMac, Apple TV and iPhone programs.
Bell earned his bachelor's degree in mechanical engineering from the University of Pennsylvania in 1988.
RECENT BLOG POSTS
Wearable device technology is predicted to grow to 284 million units by 20171. As consumers, we are increasingly looking to a range of cool, new gadgets to help keep us connected to the people we care about, and even to … Read more >
You may have heard me drop hints about it at MakerCon in May…. and now we’re excited to update you that the first Intel® Galileo Gen 2 boards have started to roll off the production line. Introducing Intel® Galileo Gen … Read more >
What do you get when you combine some interesting new technology with avatars and mobile chat messaging capability? A completely new way to connect, chat and have a little fun! Over the years, our very own Intel Labs have become … Read more >
The post And Now for Something Completely Different: Pocket Avatars appeared first on Inside Scoop.
This year at the Consumer Electronics Show (CES) wearable and IOT technology were topics that captured the imagination of both industry insiders and people learning about these emerging trends from home. Intel CEO Brian Krzanich introduced Intel® Edison at CES with a … Read more >
The post Wearables: Tailoring Intel® Edison Technology to Provide Expanded Benefits appeared first on Technology@Intel.