VIDEO: Cracked An Atom, Then Packed for IDF Shanghai

This entry was first posted by Ken Kaplan in the Mobility@Intel blog.

Friday at Intel headquarters, I met up with Ultra Mobile Man Uday Keshavdas to see what he was packing up for his trip to Shanghai for the Intel Developer Forum. In this video, we go inside his work area and see some of the devices his team demostrated at the Consumer Electronics Show. He’s fired up to see how people react to the new designs that will be revealed at Shanghai this week, especially the sleek, new user interfaces. Then he cracks open an mobile Internet device (MID) showing where the Intel Atom processor fits. That thumbnail area packs in the computing oomph many have yet to experience in such a tiny mobile device.