Tag: Stratix

• How Heterogeneous Device Design and Manufacturing Leads to Success   By Patrick Dorsey, Vice President Product Marketing, FPGA and Power Products, Intel The following guest blog is based on remarks by Patrick Dorsey during a panel discussion on “FPGA Hardware Innovations” at the recent The Next FPGA Platform event, held in San Jose, California on January 22, 2020.   One of the looming challenges for FPGA hardware design is...
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• The Three Levels of Heterogeneity: Devices, Systems, and Software By Jose Alvarez, Senior Director, Intel CTO Office, PSG   The following blog is adapted from a keynote speech that Jose Alvarez presented as the recent The Next FPGA Platform event, held in San Jose, California.   There are three levels of heterogeneous integration. It’s a simple taxonomy. First, there’s heterogeneous integration at the chip level – the device level....
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• The Next Platform discusses Gen-Z coherent memory, UPI, and FPGAs for server architecture acceleration Last November at Supercomputing ’19 (SC19), the Gen-Z Consortium booth contained a proof-of-concept (POC) SQLite database acceleration demo that showed a 5x performance improvement in the average database INSERT operation time, with a clear path to even better performance. (See “Gen-Z Consortium demos 5x SQLite database acceleration at SC'19 with an Intel UPI link between an Intel® Xeon CPU and...
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• Be sure to read EEJournal’s new article about the world’s highest capacity FPGA, the Intel® Stratix® 10 GX 10M FPGA with 10.2 million LEs Last month saw the announcement of the world’s highest capacity FPGA, the Intel® Stratix® 10 GX 10M FPGA with 10.2 million LEs (logic elements). (See “Intel announces Intel® Stratix® 10 GX 10M FPGA, world’s highest capacity with 10.2 million logic elements. Targets ASIC Prototyping and Emulation Markets.”) This device shipped to customers prior to the announcement and two leading vendors...
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• S2C’s free, 2-hour ASIC prototyping Webinar on December 10 will show you how to prototype billion-gate designs on world’s highest capacity FPGA Last month saw the introduction of the Intel® Stratix® 10 GX 10M FPGA, the world’s highest capacity FPGA. This device specifically targets ASIC emulation and prototyping applications. Within days, S2C, a Gold member of the Intel® FPGA Design Solutions Network, announced that it was shipping a modular ASIC prototyping system based on this FPGA, the S10 10M Prodigy Logic System...
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• Photo of Intel EMIB bridge chip – a foundational packaging technology for Intel® CPUs, FPGAs, and GPUs – appears in the wild Intel developed EMIB (Embedded Multi-die Interconnect Bridge) technology, a foundational packaging technology used in the manufacture of all Intel® Stratix® 10 GX, SX, TX, and MX FPGAs and Intel® Agilex™ FPGAs, to enable heterogeneous integration of multiple semiconductor die in one package. This high-speed interconnect technology has proven essential to the rapid development and proliferation of the latest Intel® FPGAs....
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• Low-latency key-value store resides in FPGA SRAM, delivers data in a deterministic 500 nsec Professor John Lockwood sits behind the wheel, piloting his slick electric roadster around a landscape filled with renewable energy sources: wind turbines, solar arrays, and a hydroelectric dam. He’s actually sitting at a simulation console in the Algo-Logic booth at the Supercomputing 2019 (SC’19) conference in the Denver Convention Center, watching the simulated world go by on a large-screen monitor...
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• S2C launches Prodigy Logic Systems for prototyping large ASIC designs based on the world’s highest capacity FPGA, the Intel® Stratix® 10 GX 10M S2C has announced its new line of high-capacity S10 10M Prodigy Logic Systems for ASIC prototyping, based on Intel® Stratix® 10 GX 10M FPGAs. Members of this new ASIC prototyping system family include single-, dual-, and quad-FPGA configurations. A single-FPGA system supports ASIC designs as large as 80 million ASIC gates. S2C is currently shipping the single-FPGA S10 10M Prodigy...
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• PRO DESIGN’s proFPGA quad Intel® Stratix® 10 GX 10M FPGA Prototyping System, based on the world’s highest capacity FPGAs, has a prototyping capacity of 2 billion ASIC gates PRO DESIGN Electronic Gmbh is the first company to release details of an ASIC and SoC prototyping and verification system based on the just-announced Intel® Stratix® 10 GX 10M FPGA, the world’s highest capacity FPGA with 10.2 million logic elements (LEs). The proFPGA quad Intel® Stratix® 10 GX 10M FPGA Prototyping System incorporates four pluggable FPGA modules based on the...
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• Want to see a photo of the world’s highest capacity FPGA, the Intel® Stratix® 10 GX 10M? How about two photos? Following yesterday’s announcement of the world’s highest capacity FPGA, the Intel® Stratix® 10 GX 10M, with 10.2 million logic elements (LEs), see “Intel announces Intel® Stratix® 10 GX 10M FPGA, world’s highest capacity with 10.2 million logic elements. Targets ASIC Prototyping and Emulation Markets,” some people have asked me whether or not this device is real. The one-word answer is:...
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