Corning Announces 5G In-Building Network Collaboration with Intel using Intel® Xeon® Scalable processors, Intel® FlexRAN Reference Architecture, and Intel® FPGA PAC N3000

Yesterday, Corning announced a collaborative effort with Intel to accelerate the availability of 5G communications within buildings. The collaboration will ultimately deliver a virtual platform for Corning’s 5G network solutions powered by Intel® Xeon® Scalable processors, based on the Intel® FlexRAN Reference Software Architecture, and incorporating the Intel® FPGA Programmable Acceleration Card (PAC) N3000 and 10/25/40Gb Intel® Ethernet 700 Series Network Adapters. According to the announcement, the platform will be commercially available next year.

Michelle Engarto, VP of wireless product line management for Corning Optical Communications, is quoted in a FierceWireless article titled “Corning, Intel team up for in-building 5G, leveraging vRAN,” as saying:

“It’s surprising how prevalent wireless is indoors, with more businesses allowing employees bringing their own devices to work and increasing demands on connectivity.”

Cristina Rodriguez, vice president and general manager of the Wireless Access Networks Division, Data Center Group at Intel, said:

“This Intel-based foundation for next-generation virtualized radio access networks (vRAN) will enable customers to reap the full benefits of 5G based platforms for ultra-reliable low latency, enhanced mobile bandwidth, and massive machine-to-machine communication both inside and outside their buildings.”

Intel FlexRAN Reference Software Architecture is an end-to-end Intel reference architecture for implementing software-based radio stations that can sit on any part of the wireless network from edge to core. The Intel FlexRAN platform solution performs the entire 4G and/or 5G layer 3, 2, and 1 processing. Intel Xeon Scalable processors are used to implement layers 3 and 2 and some of layer 1, and the Intel FPGA PAC N3000 card are used to accelerate the remainder of layer 1 and fronthaul connectivity. The Intel FPGA PAC N3000 card is a full-duplex, 100 Gbps, in-system re-programmable acceleration card that supports multi-workload networking application acceleration. It is based on an Intel® Arria® 10 FPGA.

To learn more about Corning’s in-building network solutions, click here.



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Steven Leibson

About Steven Leibson

Be sure to add the Intel Logic and Power Group to your LinkedIn groups. Steve Leibson is a Senior Content Manager at Intel. He started his career as a system design engineer at HP in the early days of desktop computing, then switched to EDA at Cadnetix, and subsequently became a technical editor for EDN Magazine. He’s served as Editor in Chief of EDN Magazine and Microprocessor Report and was the founding editor of Wind River’s Embedded Developers Journal. He has extensive design and marketing experience in computing, microprocessors, microcontrollers, embedded systems design, design IP, EDA, and programmable logic.