Chiplets (tiles) create a high-speed path for getting new FPGAs to market
These days, trade publications routinely publish articles about chiplets and related technologies. For example, on June 20, Mark LaPedus published an article on the SemiconductorEngineering.com Web site titled “What’s Next In Advanced Packaging” that said: “While scaling remains an option for new designs, the industry is searching for alternatives. Another way to get the benefits of scaling is...
Intel releases Royalty-Free, High-Performance AIB Interconnect Standard to Spur Industry’s Chiplet Adoption and Grow the Ecosystem
Back in 1965, in his landmark article titled “Cramming more Components onto Integrated Circuits,” Gordon Moore noted that, “…It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected.” The budding semiconductor industry had other ideas and has taken a wild ride down the scaling slopes, going from micron-sized...