Category: EMIB

• Semiconductor Engineering Magazine wonders whether Chiplet Technology is Good or Bad. Intel’s answer: Good, Very Good Mark LaPedus, the Executive Editor for Manufacturing at SemiEngineering.com, recently published an article titled “The Good And Bad Of Chiplets.” From the Intel perspective, there’s only good. LaPedus writes: “With chiplets, the goal is to reduce product development times and costs by integrating pre-developed dies in an IC package. So a chipmaker may have a menu of modular dies, or...
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• The Three Levels of Heterogeneity: Devices, Systems, and Software By Jose Alvarez, Senior Director, Intel CTO Office, PSG   The following blog is adapted from a keynote speech that Jose Alvarez presented as the recent The Next FPGA Platform event, held in San Jose, California.   There are three levels of heterogeneous integration. It’s a simple taxonomy. First, there’s heterogeneous integration at the chip level – the device level....
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• Want a preview of the Intel keynote at The Next FPGA Platform Event? The Next Platform just published one Next week, The Next FPGA Platform event takes place in downtown San Jose. This day-long event includes several talks and panels devoted specifically to datacenter topics with an emphasis on FPGA acceleration. Several speakers and panelists from Intel will be there and Timothy Prickett Morgan, co-editor and co-founder of The Next Platform, has just published an article titled “Covering All...
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• Intel announces Intel® Stratix® 10 GX 10M FPGA, world’s highest capacity with 10.2 million logic elements. Targets ASIC Prototyping and Emulation Markets By Patrick Dorsey, Vice President Product Marketing, FPGA and Power Products, Intel Network and Custom Logic Group   Multiple customers have already received operational samples of the new Intel® Stratix® 10 GX 10M FPGA, the world’s densest FPGA with 10.2 million logic elements (LEs), and the device is now in production. This extremely dense FPGA is based on the existing...
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• Chiplets (tiles) create a high-speed path for getting new FPGAs to market   These days, trade publications routinely publish articles about chiplets and related technologies. For example, on June 20, Mark LaPedus published an article on the SemiconductorEngineering.com Web site titled “What’s Next In Advanced Packaging” that said:   “While scaling remains an option for new designs, the industry is searching for alternatives. Another way to get the benefits of scaling is...
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• Intel releases Royalty-Free, High-Performance AIB Interconnect Standard to Spur Industry’s Chiplet Adoption and Grow the Ecosystem   Back in 1965, in his landmark article titled “Cramming more Components onto Integrated Circuits,” Gordon Moore noted that, “…It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected.” The budding semiconductor industry had other ideas and has taken a wild ride down the scaling slopes, going from micron-sized...
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