How Heterogeneous Device Design and Manufacturing Leads to Success
By Patrick Dorsey, Vice President Product Marketing, FPGA and Power Products, Intel The following guest blog is based on remarks by Patrick Dorsey during a panel discussion on “FPGA Hardware Innovations” at the recent The Next FPGA Platform event, held in San Jose, California on January 22, 2020. One of the looming challenges for FPGA hardware design is...
Intel releases Royalty-Free, High-Performance AIB Interconnect Standard to Spur Industry’s Chiplet Adoption and Grow the Ecosystem
Back in 1965, in his landmark article titled “Cramming more Components onto Integrated Circuits,” Gordon Moore noted that, “…It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected.” The budding semiconductor industry had other ideas and has taken a wild ride down the scaling slopes, going from micron-sized...