Wearables: Tailoring Intel® Edison Technology to Provide Expanded Benefits

This year at the Consumer Electronics Show (CES) wearable and IOT technology were topics that captured the imagination of both industry insiders and people learning about these emerging trends from home.

wearables

CES Keynote Speaker Brian Krzanich Intel CESIntel CEO Brian Krzanich introduced Intel® Edison at CES with a vision of bringing Intel Architecture performance, computing capability and Internet connectivity to new wearable and IOT devices. Scheduled for summer availability, Intel® Edison is a product-ready, general compute platform with built-in wireless for those who wish to create a wearable or small form factor device.

We have received an enthusiastic response from the pro maker and entrepreneurial communities, as well as consumer electronics and industrial IoT companies. And have decided that in order to best address a broader range of market segments and customer needs we will extend Intel® Edison to a family of development boards.

Notable enhancements include the use of the leading-edge 22nm Silvermont dual core Intel® Atom SOC; increased I/O capabilities and software support; and a new, simplified industrial design. This provides greater performance, increased durability and additional cost savings.

  • Silvermont: While we work to extend the Intel Quark SoC family with multi-core offerings, we’ve prioritized bringing the board powered by the 22nm Silvermont dual core Intel® Atom SOC to market first to best meet a broad range of market needs. Offering a dual core, dual threaded CPU at 500MHz with an additional MCU and over 30 I/O interfaces via a small 70-pin connector the product will offer solid performance for wearable or small form factor device creators.
  • Increased IO and software support: Intel® Edison supports existing, familiar IA-based programming tools and will be compatible with accessible developer tools used by the maker community, such as the Arduino* IDE and Wolfram Language. Intel plans to also add support for Yocto Linux, Node.js and Python. Intel® Edison will continue to be connected with Wi-Fi and Bluetooth LE* support.
  • With a new industrial design: Slightly larger than an SD card, Intel® Edison will provide more value for our customers by simplifying the design process for the companies creating the designs, increasing the durability and providing additional cost savings in comparison to building for an SD form factor.

Intel is moving at an accelerated pace with rapid innovation to address a variety of market opportunities. We believe the Intel® Edison family offers individuals and small, innovative companies a compelling platform to introduce smart and connected wearable and IOT products that will delight people in new and unexpected ways.

Michael A. Bell

About Michael A. Bell

Michael A. Bell is corporate vice president and general manager of the New Devices Group for Intel Corporation. In his role, Bell leads a global team chartered with developing products and technologies that will enhance and extend Intel's product portfolio into new areas of computing, including wearable technology. Previously, Bell co-lead the Mobile and Communications Group with Hermann Eul, a worldwide organization focused on the development of hardware, software and connectivity ingredients for phones, tablets, Ultrabook™ and other mobile devices, and complete system solutions. Prior to joining Intel in 2010, Bell was part of the executive management team at Palm Inc. From 2007 to 2010 he served as senior vice president of product development. He was responsible for all aspects of product strategy, development and deployment, bringing the Palm PRE, the Palm PIXI and many more products to market. Prior to his time at Palm, Bell was vice president, CPU Software, Macintosh Hardware Division, at Apple Inc. Over the course of his career at Apple, spanning 1991 to 2007, he made significant contributions to the iMac, Apple TV and iPhone programs. Bell earned his bachelor's degree in mechanical engineering from the University of Pennsylvania in 1988.

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