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September 2009 Archive

Moorestown Drives Innovation in the Ultra-Mobile Segment

posted by Sylvia Flores on September 29, 2009

The world of mobile entertainment along with always-on Internet is exploding, as consumers and road warriors demand greater connected experiences on the go. Mobile Internet Devices (MIDs) and smartphones are paving the way with advanced and highly efficient audio, video, camera and imaging usages, along with premium content delivery. Driving this effort, is the Intel® Atom™ processor-the world’s smallest processor. And the next-generation is coming to us in 45nm high-k system-on-a-chip (SoC) process technology, codenamed Moorestown.

At this year’s Intel Developer Forum in San Francisco, Intel Fellow and Chief Platform Architect for the Ultra Mobility Group, Shreekant (Ticky) Thakkar discussed the various usage models surrounding this exceptional, low-power processor that is effectively creating a big computer experience in a small and pocketable device. In volume, MIDs, handheld productivity devices, portable media players, game consoles, navigation devices, along with high-end smartphones will see an influx in the growing mobile landscape as Moorestown enables immersive experiences, such as:

  • Live video streaming
  • Video chat and video conferencing
  • Quality picture and video clip captures along with editing capabilities
  • Instant upload of pictures, video clips, blogs, and more to the Internet
  • Mobile TV and video services
  • Streaming audio
  • Voice memo recording
  • 3G, WiFi, and WiMAX options for always-on, always connected (AOAC)

Moorestown SoC process technology offers hardware accelerated HD video playback, allowing users to render video on local or external displays. Moorestown also offers support for key codecs and file containers, enabling DRM protected video playback and media frameworks with hardware acceleration. And with a strong MIDs ecosystem in place supporting Moorestown, users will encounter compelling, connected experiences with additional enabling software including Linux, Real, Adobe, Eyecon, Move Networks, Inc., Discretix, and LiveCast.

For more on Ticky Thakkar’s presentation at IDF, download the presentation (PDF 1.75MB). Moorestown_IDF.pdf

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Connecting the Ultra-Mobile Universe with Moorestown

posted by Sylvia Flores on September 28, 2009

Revolutionizing the ultra-mobile segment of Mobile Internet Devices (MIDs) and the future of smart phones, Intel’s next-generation Intel® Atom™ processor, codenamed Moorestown, made a larger-than-life splash at this year’s Intel Developer Forum (IDF) in San Francisco.

Intel Fellow and Chief Platform Architect for the Ultra Mobility Group, Shreekant (Ticky) Thakkar showcased the technology’s highlights including:

  • Extended battery life, running the full Internet with ultra-low power designs

  • Access to the full Internet

  • Always-on connectivity

Supporting a host of mobile devices, Intel’s Moorestown offers 3G, WiFi, and WiMAX options-100% compatibility at the application level with Linux for PC-exceptional media performance-while enabling smartphone form factors. And Moorestown reduced its board size at least 2x from previous generation Menlow, while decreasing its standby power up to 50%. With an idle power similar to current smartphone levels, this generation is offering serious computing power in the palm of your hand.

Based on 45nm high-k SoC process technology, Moorestown incorporates Intel® Hyper-Threading Technology (Intel® HT Technology) for high performance along with OpenGL ES 2.0 and OpenVG 1.0 graphics, making it an incredibly robust platform for mobile devices. Moorestown also offers Intel® Burst Performance Technology (Intel® BPT) for additional performance, taking advantage of thermal headroom and reduced system frequency, while saving consumed CPU and platform energy.

For more on Ticky Thakkar’s presentation at IDF, download the presentation (PDF 1.75MB) Moorestown_IDF.pdf

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Hardware-based Virtualization Built Into Next-Gen Nehalem-EX

posted by Sylvia Flores on September 25, 2009

Intel Senior Fellow Stephen Pawlowski delivered a session at this week’s Intel Developer Forum (IDF) on Intel’s latest industry-standard, mission-critical platform codenamed Nehalem-EX. And one of the key topics of discussion? Intel® Virtualization Technology (Intel® VT).

Nehalem-EX offers scalability along with world-record virtualization performance, enabling the highest consolidation ratios of any industry-standard server. And as IT departments across the board move to lower costs while increasing hardware utilization, Intel has responded to their needs by improving and enhancing its hardware-based virtualization technology.

With Nehalem-EX, Intel has created a feature that enables data packets to come in and be tagged to the appropriate virtual machine (VM). The hardware then places those packets into hardware queues that are focused on a particular Virtual Machine Manager (VMM). Once packets arrive, they are delivered to the appropriate VM in packet order and are re-packetized and put in the appropriate VM queue before they get sent to the virtual machine. It’s Intel’s hardware that is making virtualization software perform even better.

Including broad industry support for an era that is increasingly moving towards the cloud, virtualization technology combined with energy-efficient performance and RAS-rich environments provide a reliable, scalable environment that IT departments can bank on.

Download Stephen Pawlowski’s IDF session (PDF 1.94MB) Nehalem-EXStevePawlowski_IDF.pdf

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Senior Intel Fellow Talks: Nehalem-EX and Total Cost of Ownership (TCO)

posted by Sylvia Flores on September 25, 2009

This week’s Intel Developer Forum (IDF) brought about amazing technology reveals and insights from the girls and boys in blue from Intel. And Intel Senior Fellow Stephen Pawlowski delivered the goods on Intel’s latest mission-critical platform, codenamed Nehalem-EX.

A major point of interest in his session was TCO. Within the next year, as Nehalem-EX makes its debut as Intel’s industry-standard, mission critical server, there will be a lot of talk and benchmarking around energy-efficient performance and reducing TCO. This should peak IT’s interest as they work to remain or build a data center within a reduced power footprint while getting better compute density. And with Virtualization and RAS features built right into the hardware, Nehalem-EX brings advanced reliability and scalability never before seen in an industry-standard server.

Download Stephen Pawlowski’s IDF session (PDF 1.94MB) Nehalem-EXStevePawlowski_IDF.pdf

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Mission Critical? Meet Next-Gen Nehalem-EX.

posted by Sylvia Flores on September 25, 2009

Let’s face it-there’s a large following around Intel® Xeon® processors. After all, they are the world’s most widely deployed server, and for good reasons. IT has grown to rely on Intel Xeon processors for their performance, reliability, virtualization capabilities, and a whole lot more.

And at this week’s Intel Developer Forum (IDF) in San Francisco, Intel Senior Fellow Stephen Pawlowski took the stage to discuss the next generation of Intel Xeon processors, codenamed Nehalem-EX. “We’ve had a number of customers who have come to us and said, ‘we want to be able to use Xeon and also the mission critical segment. What kinds of things or what kinds of capabilities can you put in there?’” spoke Pawlowski in his IDF session. The answer? Intel is throwing a whole lot at Nehalem-EX in response to growing demands.

“Nehalem-EX processor is an eight-core chip connected through a bidirectional ring interconnect. It still leverages the hyper-threading technology that was put into Nehalem,” said Pawlowski. “And in the end, the benefit especially in the market segments that are traditionally leveraged through transaction computing saw significant benefits, in some cases, upwards to 30 and 40 percent.”

Designed for mission-critical performance, RAS, along with hardware-based virtualization, Nehalem-EX has got an industry-standard server makeover, with the ability to monitor, report, and recover from hardware errors to maintain data integrity and keep mission-critical services online. And that’s just the half of it. With Nehalem-EX, IT and business knows that they’ve got a solid roadmap they can rely on for years to come.

Download Stephen Pawlowski’s IDF session (PDF 1.94MB) Nehalem-EXStevePawlowski_IDF.pdf

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Intel Helps Consumers Fall in Love with TV All Over Again

posted by Mary Ragland on September 25, 2009

For many, watching TV is a passive activity versus an interactive experience. Television as it currently exists, regardless of its use across cultures, is simply a conduit for delivering packaged information. But if Internet applications and interactivity is added to this package, the viewer experience will dramatically change.

At IDF this week in San Francisco, Intel took the wraps off the 45nm Intel® Atom™ processor CE4100, the newest system-on-chip (SoC) in a family of media processors designed to bring Web content and services to the TV. It does this by providing a TV software development framework, now optimized with Adobe* Flash*, to bring visually compelling content like 3-D gaming, video streaming and social networking to the TV. The SoC supports Internet and broadcast sources on one chip and has the processing power to run complex media applications like 3-D graphics.

Consumers desire to “spice things up” with their TV - they want interaction, digital entertainment and real time information for a true multimedia experience. TV Widgets, or small Internet applications found right on your TV screen, will enhance traditional TV and allow you to view your favorite programs while at the same time accessing Web content — all on one screen.

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Lighting Fast - High Speed Optical Connectivity

posted by Ben Hacker on September 22, 2009

Once relegated only to datacenter and telecom environments with high price points, optical technology may soon find its way into mainstream client systems, consumer electronics, and even handhelds. A new technology was announced at Intel Developer Forum (IDF) which provides initial data rates of 10 Gigabits and potential scalability to 100 Gigabits and beyond; something copper IO won’t be able to achieve.

Light Peak also supports multiple simultaneous protocols which will allow bandwidth aggregation of the various interconnects used in systems today onto a single high speed, thin, flexible, and long cable and small connector. Imagine being able to connect to your camera, display, docking station, or external hard drive through a single, thin connector!

Light Peak makes this possible by moving the next IO speed increase to optical and getting away from the electro-magnetic interference (EMI) and thickening and shortening of cables that are plaguing copper IO technologies today. Unlike the current high cost optical technologies in the datacenter, Light Peak will bring the benefits of optical in a mainstream client-ready cost footprint.

Light Peak is in the developmental stages, but Intel Executive Vice President General Manager, Intel Architecture Group Dadi Perlmutter showed a demonstration of real silicon transmitting storage, LAN data and display (1080p) data across a single thin, 30m fiber optic cable.

Intel will be working with the industry to determine the best way to make this new technology a standard and to accelerate its adoption on a plethora of devices including PCs, handheld devices, consumer electronic devices and more. The end goal is to make Light Peak a complement to existing I/O technologies by enabling them to run together on a single cable and at higher, and more scalable speeds.

With its potential for future I/O speed increases, and as rich multimedia proliferates, Light Peak can enable technologies and systems that share data both in the home and office to continue to deliver full speed external IO that can keep pace with internal compute device bandwidth.

The future of computing looks as bright as the past… and optical technology is helping to light the way.


Ben Hacker

More resources:
http://techresearch.intel.com/articles/None/1813.htm
http://www.intel.com/go/lightpeak

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Internet TV Applications will Change our Relationship with Television

posted by Mary Ragland on September 16, 2009

Consumers talk about their television as many things: an object, a technology, a language, an addiction, an experience and most interestingly, as a relationship. The most striking observation about this relationship is what it is lacking: interaction.

This lack of interactive activity leads many of us to multi-task, or “cheat” with other devices such as laptops and smart phones - while watching TV. In short, the honeymoon phase with TV is over, and people are beginning to fall out of love with the current experience.

At last year’s Intel Developer Forum, a new software TV application framework called Widget Channel was unveiled that blends community and content aspects of the Internet with the simplicity and entertainment strengths of the TV.

TV Widgets, or small Internet applications found right on your TV screen, will enhance traditional television and allow consumers to view their favorite programs while simultaneously accessing Web content, all of which can be seen on one screen and personalized to meet the viewer’s needs.

Here’s a video of Bill Leszinske, GM of Intel’s Digital Home Group, who talks about interactive TV tends and how Intel’s technology plays a key role:

Stay tuned for IDF 2009 in San Francisco on Sept. 22-24 where Intel will show the latest technology for Internet-enabled CE devices and digital TVs.

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Recent Study Shows People Want Internet, TV Combo

posted by Mary Ragland on September 14, 2009

Broadband has revolutionized the way people communicate and share information. This realization hit home after moving my son to his new digs at UCSD (University of California, San Diego). Now I know I need to cut the apron strings; but I found myself texting him, which is less intrusive than a phone call, right? It went something like this: “Ellen DeGeneres joins American Idol as a judge?” And sadly, “Do you want to join my Facebook?”

It occurred to me that now more than ever, communication through broadband data networks has become common place in our everyday lives — whether it’s through cell phones, laptops or connected CE devices. In fact, “Internet TV” is gaining a lot of attention these days, so it didn’t surprise me to see the Reuters article on September 4 that highlights a study conducted by The Diffusion Group showing more than three-fourth of adult broadband users perceive widget-based net-TV applications as a valuable addition to their TV experience.

Continued

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Scaled Performance, Maximized Energy Efficiency On-the-Go - Coming Soon!

posted by Suzy Ramirez on September 14, 2009

Social networking and the Internet are driving consumer content creation from niche to mainstream. Whether its blogging about recent travels, editing and posting home videos, uploading photos of the kids, downloading or even composing music, almost everyone engages in some form of content creation.

At the Intel Developer Forum (IDF) 2009, next week in San Francisco, Intel will highlight new mobile processor technology that can scale from more demanding processing needs - such as video editing, music streaming and gaming - to more simple, less demanding tasks like sending an email.

So what does this mean? More efficient use of processing power. In short, your computer will be able to shift gears and adjust performance and power consumption when needed. So when you’re streaming music while editing photos and posting videos to YouTube, the new Intel processor technology will allow your computer to “fire on all cylinders” and amp up performance to meet the demands of simultaneous multimedia activities, but only when you need it.

Stay tuned for more details at Fall IDF 2009!

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Sneak Peek - Intel Developer Forum Preview

posted by Bill Kircos on September 13, 2009

In San Francisco Sept. 22-24, "the world's biggest geekfest" will take place at Moscone Center West. In its 12th year, the Intel Developer Forum highlights Intel's upcoming technology advancements and product plans to top CIOs, CTOs, hardware and software experts and industry analysts, bloggers and media.

< For breaking news today ahead of IDF, please visit here >


Next week, we will have more than 5,000 incredibly talented technologists and media on hand, along with seven Intel exec keynotes, numerous "tech insights" - and another 125 classes, panels and sessions, all in the name of advancing computing and the high-tech industry.

Now, how do you provide an in-depth look at Intel's plans when we now sell more than 300 products, oversee multiple and exciting new brand families like Core, Xeon, vPro and Atom, and mix in hundreds of R&D projects and a myriad of software, technology and industry standards underway?

The answer, or theme, is found under three 25+ year-old Intel mantras:

  1. Relentlessly pursue Moore's Law
  2. Deliver world-class manufacturing and capacity - at molecular levels
  3. Constantly innovate and integrate from sand to silicon

All three of these areas will make up the foundation of just about everything you will hear at this year's IDF. Think about it for a minute. Moore's Law and our manufacturing prowess, which heads into its second generation of reinvented transistors, have led to an incredible amount of innovation and integration, such as:

  • The omnipresent Core-branded family of laptop and desktop processors -- including our next-generation, 32-nanometer process technology "Westmere" or "Dales" chips, and "Sandy Bridge" after that. The Dales will add another first in Intel's rich history, integrating graphics into our processor products for the first time, increasing performance in areas like videos, and lowering costs.
  • Intel Turbo Technology - a processor that adapts to you? Turbo Boost can automatically adjust processing performance based on the type of work or fun you're doing on your computer for a quick boost in performance and/or better energy efficiency. Playing a high-end game and doing other things at the same time? We can throw all four processing cores at that. Doing one task that requires a single boost of processing power? Done.
  • Incredible battery life advancements -- where we've added a multitude of electricity-saving features inside our Core chips, under the battle-cry HUGI, or "huggy" - Hurry Up and Get Idle. All in our quest to maximize the amount of time between re-charging our laptops. In fact, today's Intel laptop chips go idle even in between keystrokes.
  • A multitude of business-class features -- for some of our vPro desktop and laptop PCs and popular Xeon-based servers, including virtualization, security, anti-theft technology and remote computer repair. Those features, and added performance, let CIOs recoup their server investments in months versus years.
  • Larrabee - the codename of an upcoming family of Intel products that ultimately will have numerous processing and graphics engines inside one chip and provide stunning visual computing experiences.
  • Smarter System on Chips (SoCs) - the ability to both tailor and integrate even more technologies into tiny chips for a variety of computing devices.
What else can you expect from IDF besides a private concert with Maroon 5 for attendees? Here's a snapshot:


Tuesday
Keynotes from Intel President and CEO Paul Otellini, IDF veteran and senior VP Pat Gelsinger and for the first time senior VP of manufacturing Bob Baker will keynote. Look for the latest on our manufacturing, Core and Atom future plans from hand-helds to big-iron servers.

Wednesday
Keynotes from exec VP Dadi Perlmutter and VP Renee James. The emphasis will be on all-things mobile, and of course our newest laptop chips (codenamed Nehalem / Clarksfield). Renee will tie all of Intel's hardware efforts with our vast and increasing software enabling focus, ranging from the key features and work on Windows 7 to myriad developer programs and plans from handheld to high-end computing.

Thursday
Senior VP Eric Kim and senior fellow and VP Justin Rattner hit the stage. Both will talk about how smarter processors will be at the heart of innovation to help bring consumers an interactive Internet/TV experience. Look for an update on the company's "Sodaville" Atom processor, the next generation SoC in a family of media processors based on Intel® Architecture (IA). And, prepare to see a glimpse at what an immersive TV and computing experience will look like in the years to come.

If you've read this far, then please take a couple of more minutes and tell us what you want to see at IDF this year...and please follow the industry at IDF via our blog, twitter, facebook and news room.

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Intel News Ahead of IDF: New Chips; Manufacturing Efforts

posted by Bill Kircos on September 13, 2009

Ahead of what will be a packed Intel Developer Forum, Sept. 22-24 in San Francisco, here's some news around a newly planned family of future "embedded" processors for non-PC equipment and gear code-named Jasper Forest -- and details around our manufacturing prowess, specifically in our shift to 32 nanometer production.

< Click here for an IDF preview -- and/or all of our IDF news here >

How do these relate? Well, while Jasper Forest will be based on 45 nanometer manufacturing, it takes advantage of that process and our high-k, metal gate transistor technology to deliver eye-opening low-watt numbers. This manufacturing prowess also enables Jasper Forest to innovate and integrate, in this case adding in for the first time an I/O hub right into the chip. And of course, all of this just gets better as we prepare for our 32 nanometer process on tap. Both firsts for Intel.

(Note - a 32 nanometer, future Core processor video coming soon)

The News, Part I

  • Jasper Forest for embedded, communications and storage equipment will provide the same robust performance of our Nehalem-based Intel® Xeon® processor 5500 series - but with a 27-watt system power savings.

  • It's another example of Intel innovating and integrating. For the first time, Intel will integrate the I/O hub directly onto a dual-processing Intel Xeon processor, eliminating the need for a separate I/O hub in the board design, thus providing "real estate" and power savings.

  • These design features and thermals will be ideal for dense storage and communications solutions such as Storage Bridge Bay designs and CompactPCI blades used in carrier equipment. The chips will also be used in wireless infrastructure, routers, military, security, IPTV, VoIP, NAS, SAN and wireless radio network controllers.

  • Another key benefit is the ability of developers to now use Intel architecture to run workloads that traditionally only functioned on non-Intel processors. For example, comms solutions can now consolidate workloads for both the control and data plane all on one Intel® architecture system.

  • Intel will highlight some companies who plan to integrate Jasper Forest at his IDF keynote speech next week.
  • The News, Part II

  • Intel's process technology is by far the most advanced of any semiconductor manufacturer in the world. That and Moore's Law help us to "innovate and integrate" to deliver those super-thin laptops with great battery life everyone loves, super-fast servers and desktop PC gaming dream machines, and much more.

  • Intel's 32nm CPU process is now certified and Westmere CPU wafers are moving through the factory in support of planned Q4 revenue production.

  • Intel is now advancing to the second-generation high-k+ metal gate transistor formula, giving Intel a 3+ year advantage in addressing leaky and energy IN-efficient transistors. Intel has shipped >200 million 45nm CPUs using high-k+ metal gate transistors.

  • For the first time, Intel has developed a full-featured SoC process technology to complement the CPU-specific technology. This version is for our smarter System on Chip (SoC) product efforts, which emphasize lower power transistors.

  • These advances combine to deliver record performance in terms of the highest drive current (electricity that flows when a transistor is on); the lowest leakage currents (keeping a lid on wasteful or lost electricity) and the tightest gate pitch (how closely transistors can be pack in) versus any reported 32nm or 28nm technology in the industry.

  • In addition, our NMOS transistors now have 19% performance improvement over their 45nm counterparts and our PMOS transistors now have a 28% performance improvement over their 45nm counterparts.

  • Translation? Faster, more energy-efficient and sleeker computers and consumer devices, at lower costs.

    Net-net, when you have hundreds of millions of transistors inside our chips like we do, all of this is critically important and advantageous.

    Here is even more info on both of these news announcements. And, please follow us at IDF...the blog, on twitter, our fan page, and media center.

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    Chip Chat: Genevieve Bell on Social Media

    posted by Allyson Klein on September 04, 2009

    I last wrote about the great conversation I recently had with Genevieve Bell, the Intel Fellow who is responsible for tracking how people around the world adopt and utilize technologies, and how technology innovation should be driven to address emerging user requirements. The second half of the interview takes us forward into a conversation on social media and what impact (or lack of impact) this phenomenon is having shaping cultures today. There is no topic that my peers and I discuss more these days and I was fascinated by Genevieve’s view on the world of Facebook and Twitter. I think you may be too.

    Here’s the interview

    If you like the Chip Chat program let us know and tell us about what types of topics you’d like us to discuss and what technologists you’d like us to interview. Our episodes are available on the Intel site as well as on iTunes.

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