In this post, I share with you an interview with Jeff Ravencraft who is a technology strategist in Intel’s Communication Technology Lab, where he leads Intel’s effort in USB and Wireless USB. Jeff is also the Chairman and President of the USB Implementers Forum (USB-IF) industry group, Chairman of the Wireless USB Promoters group, and also serves as the USB 3.0 Promoter group chairman.Brian: Hi, Jeff. Thanks for taking the time to talk about USB 3.0. Give us a quick overview of what was announced at IDF this year. Jeff: Sure. In Pat Gelsinger’s keynote address, he announced that Intel is leading the formation of the USB 3.0 Promoter group to define and promote SuperSpeed USB, the next generation personal interconnect technology to meet the needs of multimedia consumer electronics, PC peripherals, and mobile devices. The first objective of the promoter group will be to complete the USB 3.0 specification by first half 2008. Brian: What is different about USB 3.0 and why will people care? Jeff: The primary objective with USB 3.0 is a proposed performance increase to over 10x of Hi-Speed USB which today is 480 Mbps. This is a significant enhancement for consumers who are working more and more with ever expanding file sizes such as movies. For example, a 25 GB HD Movie would take only 70 seconds to transfer between devices. Studies show that a consumer’s patience on waiting time is about 1.5 minutes and after 5 minutes they abort what they were doing. That same file transferred over High-speed USB would take 13.9 minutes – an unacceptable wait time for most people. Although this is the principle objective of USB 3.0 many of the media intense applications will be used on mobile platforms where preserving battery life is also fundamentally important. Power efficiency will be the second principle objective for the next USB specification. Brian: At IDF, we also talked about Wireless USB 1.1. I know for myself, I would love to get rid of as many wires as I could. Why is the industry continuing to promote wired USB and not just placing all our effort towards wireless? Jeff: I get that question all the time. First, it’s about the consumer who wants choice and flexibility. One method isn’t always the most optimal. Secondly, wired USB delivers power to many portable devices and also allows those devices to recharge their batteries. For example, I see that you are recharging your wireless headset via USB right now. Third, not all environments are conducive to wireless technology. And finally, wired connections are simply more reliable than wireless. I know that usually when I have a choice between wired and wireless, I go wired. Brian: When do you expect the first USB 3.0 devices to be available? Jeff: If the USB 3.0 Promoter’s group meets its objective of spec completion in the first half of 2008, then we should see the first silicon solutions on the market in 2009, followed by end products in late 2009 or early 2010. Brian: What other companies are involved in the development of the spec? Jeff: HP, Microsoft Corporation, NEC Corporation, NXP Semiconductors and Texas Instruments Incorporated are all members of the USB 3.0 Promoter Group. Brian: Jeff, thanks for your time today. Jeff: My pleasure.
Connect With Us
- Qingfeng Zhu on The Third Eye View
- Anil on The Third Eye View
- Olajfestmény on Intel and Stanford Researchers Reveal Peptide Chip Details to Categorize Diseases and Analyze Protein Interactions
- Tony Rivers on Intel and Stanford Researchers Reveal Peptide Chip Details to Categorize Diseases and Analyze Protein Interactions
- Neel on Our ISTC-VC will rock at SIGGRAPH 2012
Tags#IntelR&Dday 80-core @idf08 Big Data Cloud Computing Ct CTO energy efficient Future Lab Future Lab Radio IDF IDF2008 IDF 2010 Immersive Connected Experiences innovation Intel Intel Labs Intel Labs Europe Intel Research ISSCC Justin Rattner many core microprocessor mobility multi-core parallel computing parallel programming radio Rattner ray tracing research Research@Intel Research At Intel Day Robotics security silicon silicon photonics software development Stanford technology terascale virtual worlds Wi-Fi WiMAX wireless