Hot Topics at IDF: Thermal Technologies

posted by Dan Huynh on October 24, 2008

Smoke, lasers, and cactus showed off some of the unique technologies that highlighted the second and final day of IDF Taiwan 2008. From the Keynotes to the Demo Showcase to the Technical Sessions, Intel's emphasis on thermal technology innovation was omnipresent at IDF. Razorfunfish In the Mobility Keynote, [Mooly Eden](http://www.intel.com/pressroom/kits/bios/eden.htm), VP and GM of the Mobile Platforms Group highlighted two thermal technology achievements driven by Intel. The ability to [overclock](http://en.wikipedia.org/wiki/Overclocking) CPUs is essential to the avid gamer, but can you achieve overclocked yet properly cooled notebooks? Yes. [Intel](http://www.intel.com), [Flextronics](http://www.flextronics.com/en/MarketSegments/Computing/tabid/79/Default.aspx), and [CoolIT Systems](http://www.coolitsystems.com/) demonstrated that the gamer notebook is possible. [Mooly showed off](http://intelstudios.edgesuite.net/idf_2008/tw/081021_me/f.htm) (skip to 22:30 in video link) a Flextronics gaming notebook overclocked to 3.55 GHz plowing through Enemy Territory: Quake Wars. In order to cool this blazing fast system, CoolIT Systems has developed a [cooling docking station](http://www.coolitsystems.com/index.php?option=com_content&task=view&id=109&Itemid=1) with Intel to cool these overclocked, high performance gamer laptops. Later in the [Mobility Keynote](http://intelstudios.edgesuite.net/idf_2008/tw/081021_me/f.htm) (skip to 32:30 in video link), Mooly invited Rajiv Mongia, Principal Engineer of the Thermal Technologies Team to showcase a novel approach to cooling laptops today. By applying thermal technology employed in jet engines using [laminar airflow](http://en.wikipedia.org/wiki/Laminar), notebook designers can now make systems thinner and sleeker, keeping components cool, as well as chassis or skin temperatures. Rajiv demonstrated a comparison between [a traditional inlet vs. a laminar jet](http://news.cnet.com/8301-13924_3-10073553-64.html?part=rss&subj=news&tag=2547-1_3-0-5). Smoke was blown into a box with both types of inlets. The laminar jet inlets allowed air to flow across the inner surface of the box, while regular inlets just dispersed the smoke which limited air flow across the chassis of the box. By applying this principle used in rocket engines to laptops, the possibilities are endless in form factor design. Not only were thermal technologies highlighted in the [Mobility Keynote](http://intelstudios.edgesuite.net/idf_2008/tw/081021_me/f.htm), but there were also prevalent in the Demo Showcase and Technical Sessions. [Dynamic Power Performance Management (DPPM)](http://intel.wingateweb.com/US08/published/sessions/MPTS006/SF08_MPTS006_100r.pdf) showed off optimizing performance in an "extreme desert environment" utilizing the principles of [platform-level thermal management](http://intelstudios.edgesuite.net/fall_idf/sessions/IDF_MPTS006/f.htm). [Click for video clip](http://www.youtube.com/watch?v=HbD27ln7voo). Also, IDF technical sessions not only highlighted the thermal technologies above, but also digital thermal sensors (DTS) and thermal interface material (TIM) importance and advancement. In short, IDF Taiwan exemplified how Intel thermal technologies may be ***hot*** innovations, but your laptops will remain nice and ***cool***.

Comments (0)

tagged: air flow, CoolIT, dock, DPPM, DTS, Flextronics, gaming, IDF, Intel, Intel Developer Forum, keynote, laminar, overclocking, thermal, thermal management, TIM